VLSI Technology I

IIT Kharagpur Course , Prof. S.Kal

Lecture 1: Skal 1 - Introduction to VLSI Technology

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Lecture Details :

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VLSI Technology by Prof.Santiram Kal, IIT KGP

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1. Introduction to VLSI Technology

2. Design and Technology Overview of VLSI - I

3. Design and Technology Overview of VLSI - II

4. Yield and cost Estimation of VLSI Chips

5. Defects, Contamination & Clean Room Requirements

6. Wafer Cleaning Technology

7. Oxidation of Silicon

8. Reaction Kinetics of Oxide Growth in Silicon

9. Oxidation Techniques, Growth Rate & Characterization

10. Lithography Process

11. Photoresists

12. Optical Lithography Techniques

13. Exposure Tools and Optical Effects in Lithography

14. Advanced Lithography Techniques (X-ray,Ion-Beam,E-Beam)

15. Etching

16.

17. Dry & Plasma Etching

18.

19. Impurity Diffusion in Semiconductors

20. Diffusion Theory and Diffusion Systems

21. Impurities in Silicon and Diffusion Profile

22. Evaluation of Diffused Layers in Semiconductors

23. Ion Implantation : Range Theory and Stopping Mechanism

24. Ion Implantation Theory and Channeling

25. Ion Implant Machine

26. High Energy High Dose Implantation

27. Epitaxy Techniques and Classifications

28. Vapor Phase and Liquid Phase Epitaxy

29. VPE Growth Kinetics and MBE

30. Defects in Epitaxy Growth, Selective Epitaxy

31. Chemical Vapor Deposition (CVD): APCVD, LPCVD

32. CVD Techniques: PECVD, RTCVD, UHVCVD

33. Metal CVD and MOCVD

34. Materials for Contacts and Interconnects in VLSI

35. Metallization Techniques - I : Physical Evaporation

36. Metallization Techniques - II : Sputtering

37. Metallization Problems and Failure Mechanisms

38. Silicides and Copper Metallization

39. Isolation Technology in VLsI

40. Advanced Isolation Technology in VLSI

41. Bipolar VLSI Process Technology

42.

43. MOS VLSI Process Technology

44. Advanced VLSI MOS/CMOS Process

45. CMOS/BiCMOS Process Technology

46. VLSI Assembly & Packaging : Chip and Wire Bonding

47. VLSI Packaging Technology

Course Description :

Contents:
Introduction to VLSI - Design and Technology Overview of VLSI - Yield and cost Estimation of VLSI Chips - Defects, Contamination & Clean Room Requirements - Wafer Cleaning Technology - Oxidation of Silicon - Reaction Kinetics of Oxide Growth in Silicon - Oxidation Techniques, Growth Rate & Characterization - Lithography Process - Photoresists - Optical Lithography Techniques - Exposure Tools and Optical Effects in Lithography - Advanced Lithography Techniques (X-ray,Ion-Beam,E-Beam) - Etching - Dry & Plasma Etching - Impurity Diffusion in Semiconductors

Diffusion Theory and Diffusion Systems - Impurities in Silicon and Diffusion Profile - Evaluation of Diffused Layers in Semiconductors -Ion Implantation : Range Theory and Stopping Mechanism - Ion Implantation Theory and Channeling - Ion Implant Machine - High Energy High Dose Implantation - Epitaxy Techniques and Classifications - Vapor Phase and Liquid Phase Epitaxy - VPE Growth Kinetics and MBE - Defects in Epitaxy Growth, Selective Epitaxy - Chemical Vapor Deposition (CVD): APCVD, LPCVD - CVD Techniques: PECVD, RTCVD, UHVCVD - Metal CVD and MOCVD

Materials for Contacts and Interconnects in VLSI - Metallization Techniques - I : Physical Evaporation - Metallization Techniques - II : Sputtering - Metallization Problems and Failure Mechanisms - Silicides and Copper Metallization - Isolation Technology in VLsI - Advanced Isolation Technology in VLSI - Bipolar VLSI Process Technology - MOS VLSI Process Technology - Advanced VLSI MOS/CMOS Process - CMOS/BiCMOS Process Technology - VLSI Assembly & Packaging : Chip and Wire Bonding - VLSI Packaging Technology

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