Introduction : Glimpses of Microsystems; scaling effects – Smart materials and systems: an overview – Microsensors: some examples – Microactuators: some examples – Microsystems: some examples – Examples of smart systems: structural health monitoring and vibration control
Microfabrication processes : Structure of silicon and other materials – Silicon wafer processing; Thin-film deposition – Lithography, wet etching and dry etching – Bulk micromachining and Surface micromachining – Wafer-bonding; LIGA and other moulding techniques – Soft lithography and polymer processing – Thick-film processing; Low temperature co-fired ceramic processing – Smart material processing
Mechanics of Solids : Stresses and deformation: bars and beams – Microdevice suspensions: lumped modeling – Residual stress and stress gradients – Poisson effect; Anticlastic curvature; examples of micromechanical structures – Thermal loading; bimorph effect – Dealing with large displacements; in-plane and 3D elasticity equations – Vibrations of bars and beams – Gyroscopic effect – Frequency response; damping; quality factor – Basic micro-flows for damping calculation
Finite element method : Types of numerical methods for solving partial differential equations – What is finite element method? Variational principles – Weak form; shape functions – Isoparametric formulation and numerical integration – Implementation of the finite element method – FEM for piezoelectrics
Electronics and packaging : Semiconductor devices: basics – OpAms and OpAmp circuits – Signal conditioning for microsystems devices – Control and microsystems – Vibration control of a beam – Integration of microsystems and microelectronics – Packaging of Microsystems: why and how – Flip-chip, ballgrid, etc.; reliability – Case-study 1 (Pressure sensor) – Case-study 2 (Accelerometer)
No Reviews found for this course.