An Introduction to Electronics System Packaging
IISc Bangalore, , Prof. G.V. Mahesh
Updated On 02 Feb, 19
IISc Bangalore, , Prof. G.V. Mahesh
Updated On 02 Feb, 19
Contents:
Overview of electronic systems packaging : Introduction and Objectives of the course - Definition of a system and history of semiconductors - Products and levels of packaging - Packaging aspects of handheld products; Case studies in applications - Case Study (continued); Definition of PWB, summary and Questions for review
Semiconductor Packaging Overview : Basics of Semiconductor and Process flowchart; Video on Sand-to-Silicon - Wafer fabrication, inspection and testing - Wafer packaging; Packaging evolution; Chip connection choices - Wire bonding, TAB and flipchip-1 - Wire bonding, TAB and flipchip-2; Tutorials
Semiconductor Packages : Why packaging? & Single chip packages or modules (SCM) - Commonly used packages and advanced packages; Materials in packages - Advances packages (continued); Thermal mismatch in packages; Current trends in packaging - Multichip modules (MCM)-types; System-in-package (SIP); Packaging roadmaps; Hybrid circuits; Quiz on packages
Electrical Design considerations in systems packaging (L. Umanand) : Electrical Issues : Resistive Parasitic,Capacitive and Inductive Parasitic,Layout guidelines and the Reflection problem,Interconnection
CAD for Printed Wiring Boards : Quick Tutorial on packages; Benefits from CAD; Introduction to DFM, DFR & DFT - Components of a CAD package and its highlights - Design Flow considerations; Beginning a circuit design with schematic work and component layout - Demo and examples of layout and routing; Technology file generation from CAD; DFM check list and design rules;Design for Reliability
Printed Wiring Board Technologies: Board-level packaging aspects : Review of CAD output files for PCB fabrication; Photo plotting and mask generation - Process flow-chart; Vias; PWB substrates - Substrates continued; Video highlights; Surface preparation - Photoresist and application methods; UV exposure and developing; Printing technologies for PWBs - PWB etching; Resist stripping; Screen-printing technology - Through-hole manufacture process steps; Panel and pattern plating methods - Video highlights on manufacturing; Solder mask for PWBs; Multilayer PWBs; Introduction to microvias - Microvia technology and Sequential build-up technology process flow for high-density interconnects - Conventional Vs HDI technologies; Flexible circuits; Tutorial session
Surface Mount Technology : SMD benefits; Design issues; Introduction to soldering - Reflow and Wave Soldering methods to attach SMDs - Solders; Wetting of solders; Flux and its properties; Defects in wave soldering - Vapour phase soldering, BGA soldering and Desoldering/Repair; SMT failures - SMT failure library and Tin Whiskers - Tin-lead and lead-free solders; Phase diagrams; Thermal profiles for reflow soldering; Lead-free alloys - Lead-free solder considerations; Green electronics; RoHS compliance and e-waste recycling issues
Thermal Design considerations in systems packaging (L. Umanand) : Thermal Design considerations in systems packaging
Embedded Passives Technology :
Introduction to embedded passives : Need for embedded passives; Design Library; Embedded resistor processes - Embedded capacitors : Processes for embedding capacitors; Case study examples; Summary of materials in packaging
Conclusion and Summary - Exclusive chapter wise summary
4.1 ( 11 )
An Introduction to Electronics Systems Packaging by Prof. G.V. Mahesh, Department of Electronic system Engineering, IISc Bangalore.For more details on NPTEL visit httpnptel.iitm.ac.in
Sam
Sep 12, 2018
Excellent course helped me understand topic that i couldn't while attendinfg my college.
Dembe
March 29, 2019
Great course. Thank you very much.