COURSE LAYOUT Week 1: Introduction to microengineering devices and its applications
Week 2: Clean room, contaminants, wafer cleaning processes (DI water, RCA, metallic impurities, etc.).
Week 3: Introduction to the microheater, force sensors, microfluidic devices, its specifications, and applications.
Week 4: Masks: Types of masks, Types of Photoresists, Spin Coaters Lithography process: optical lithography,
x-ray, and e-beam lithography, lift-off techniques, soft lithography, Use of resists (spin coating, positive and negative
photoresists), photoresist pre-baking, exposure, and development.
Week 5: Etching: Isotropic/anisotropic, selectivity, wet and plasma assisted etching.
Week 6: Types of wafers and orientations. Techniques of metallization: PVD [(Sputtering DC, RF, and Magnetron), thermal
evaporation, e-beam evaporation].
Week 7: Chemical Vapor Deposition: Dielectric films (Plasma Enhance Chemical Vapor Deposition (PECVD)), Atomic Layer Deposition
Week 8: Understanding and designing the process flow for fabricating microengineering devices. Process flow for microheater, force
sensors, and microfluidic devices.
Week 9: Wafer dicing and bonding techniques. Microfluidic Chips
Week 10: Process Flow for Fabricating Flexible Force Sensors and Force Sensors on Silicon, Process Flow for Fabricating VOC sensors, Biochips
Week 11: Clinical Research: Problems and Solutions using Microengineering Device
Week 12: Visit to non-conventional Class 10000 Clean Room and discussing few equipment within