An Introduction to Electronics System Packaging

IISc Bangalore Course , Prof. G.V. Mahesh

Lecture 1: Introduction and Objectives of the course

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Lecture Details :

An Introduction to Electronics Systems Packaging by Prof. G.V. Mahesh, Department of Electronic system Engineering, IISc Bangalore.For more details on NPTEL visit

Course Description :

Overview of electronic systems packaging : Introduction and Objectives of the course - Definition of a system and history of semiconductors - Products and levels of packaging - Packaging aspects of handheld products; Case studies in applications - Case Study (continued); Definition of PWB, summary and Questions for review

Semiconductor Packaging Overview : Basics of Semiconductor and Process flowchart; Video on Sand-to-Silicon - Wafer fabrication, inspection and testing - Wafer packaging; Packaging evolution; Chip connection choices - Wire bonding, TAB and flipchip-1 - Wire bonding, TAB and flipchip-2; Tutorials

Semiconductor Packages : Why packaging? & Single chip packages or modules (SCM) - Commonly used packages and advanced packages; Materials in packages - Advances packages (continued); Thermal mismatch in packages; Current trends in packaging - Multichip modules (MCM)-types; System-in-package (SIP); Packaging roadmaps; Hybrid circuits; Quiz on packages

Electrical Design considerations in systems packaging (L. Umanand) : Electrical Issues : Resistive Parasitic,Capacitive and Inductive Parasitic,Layout guidelines and the Reflection problem,Interconnection
CAD for Printed Wiring Boards : Quick Tutorial on packages; Benefits from CAD; Introduction to DFM, DFR & DFT - Components of a CAD package and its highlights - Design Flow considerations; Beginning a circuit design with schematic work and component layout - Demo and examples of layout and routing; Technology file generation from CAD; DFM check list and design rules;Design for Reliability

Printed Wiring Board Technologies: Board-level packaging aspects : Review of CAD output files for PCB fabrication; Photo plotting and mask generation - Process flow-chart; Vias; PWB substrates - Substrates continued; Video highlights; Surface preparation - Photoresist and application methods; UV exposure and developing; Printing technologies for PWBs - PWB etching; Resist stripping; Screen-printing technology - Through-hole manufacture process steps; Panel and pattern plating methods - Video highlights on manufacturing; Solder mask for PWBs; Multilayer PWBs; Introduction to microvias - Microvia technology and Sequential build-up technology process flow for high-density interconnects - Conventional Vs HDI technologies; Flexible circuits; Tutorial session

Surface Mount Technology : SMD benefits; Design issues; Introduction to soldering - Reflow and Wave Soldering methods to attach SMDs - Solders; Wetting of solders; Flux and its properties; Defects in wave soldering - Vapour phase soldering, BGA soldering and Desoldering/Repair; SMT failures - SMT failure library and Tin Whiskers - Tin-lead and lead-free solders; Phase diagrams; Thermal profiles for reflow soldering; Lead-free alloys - Lead-free solder considerations; Green electronics; RoHS compliance and e-waste recycling issues

Thermal Design considerations in systems packaging (L. Umanand) : Thermal Design considerations in systems packaging
Embedded Passives Technology :
Introduction to embedded passives : Need for embedded passives; Design Library; Embedded resistor processes - Embedded capacitors : Processes for embedding capacitors; Case study examples; Summary of materials in packaging
Conclusion and Summary - Exclusive chapter wise summary

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