Control of Manufacturing Processes

MIT Course , Prof. David Hardt

39 students enrolled

Overview

Introduction Processes and Variation Framework - Semiconductor Process Variation - Mechanical Process Variation - Probability Models of Manufacturing Processes - Probability Models, Parameter Estimation, and Sampling - Sampling Distributions and Statistical Hypotheses - Shewhart SPC and Process Capability - Process Capability and Alternative SPC Methods - Advanced and Multivariate SPC - Yield Modeling - Introduction to Analysis of Variance - Full Factorial Models - Modeling Testing and Fractional Factorial Models - Aliasing and Higher Order Models - Response Surface Modeling and Process Optimization - Process Robustness - Nested Variance Components - Sequential Experimentation - Case Study 1: Tungsten CVD DOE/RSM - Case Study 2: Cycle to Cycle Control - Case Study 3: Spatial Modeling - Case Study 4: Modeling the Embossing/Imprinting of Thermoplastic Layers.

Lecture 1:

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        Lecture Details

        Lecture 1 Introduction -- processes and variation frameworkInstructor Duane Boning, David HardtView the complete course at httpocw.mit.edu2-830JS08License Creative Commons BY-NC-SAMore information at httpocw.mit.edutermsMore courses at httpocw.mit.edu


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        3.4

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