Overview of electronic systems packaging : Introduction and Objectives of the course – Definition of a system and history of semiconductors – Products and levels of packaging – Packaging aspects of handheld products; Case studies in applications – Case Study (continued); Definition of PWB, summary and Questions for review
Semiconductor Packaging Overview : Basics of Semiconductor and Process flowchart; Video on “Sand-to-Silicon” – Wafer fabrication, inspection and testing – Wafer packaging; Packaging evolution; Chip connection choices – Wire bonding, TAB and flipchip-1 – Wire bonding, TAB and flipchip-2; Tutorials
Semiconductor Packages : Why packaging? & Single chip packages or modules (SCM) – Commonly used packages and advanced packages; Materials in packages – Advances packages (continued); Thermal mismatch in packages; Current trends in packaging – Multichip modules (MCM)-types; System-in-package (SIP); Packaging roadmaps; Hybrid circuits; Quiz on packages
Electrical Design considerations in systems packaging (L. Umanand) : Electrical Issues : Resistive Parasitic,Capacitive and Inductive Parasitic,Layout guidelines and the Reflection problem,Interconnection
CAD for Printed Wiring Boards : Quick Tutorial on packages; Benefits from CAD; Introduction to DFM, DFR & DFT – Components of a CAD package and its highlights – Design Flow considerations; Beginning a circuit design with schematic work and component layout – Demo and examples of layout and routing; Technology file generation from CAD; DFM check list and design rules;Design for Reliability
Printed Wiring Board Technologies: Board-level packaging aspects : Review of CAD output files for PCB fabrication; Photo plotting and mask generation – Process flow-chart; Vias; PWB substrates – Substrates continued; Video highlights; Surface preparation – Photoresist and application methods; UV exposure and developing; Printing technologies for PWBs – PWB etching; Resist stripping; Screen-printing technology – Through-hole manufacture process steps; Panel and pattern plating methods – Video highlights on manufacturing; Solder mask for PWBs; Multilayer PWBs; Introduction to microvias – Microvia technology and Sequential build-up technology process flow for high-density interconnects – Conventional Vs HDI technologies; Flexible circuits; Tutorial session
Surface Mount Technology : SMD benefits; Design issues; Introduction to soldering – Reflow and Wave Soldering methods to attach SMDs – Solders; Wetting of solders; Flux and its properties; Defects in wave soldering – Vapour phase soldering, BGA soldering and Desoldering/Repair; SMT failures – SMT failure library and Tin Whiskers – Tin-lead and lead-free solders; Phase diagrams; Thermal profiles for reflow soldering; Lead-free alloys – Lead-free solder considerations; Green electronics; RoHS compliance and e-waste recycling issues
Thermal Design considerations in systems packaging (L. Umanand) : Thermal Design considerations in systems packaging
Embedded Passives Technology :
Introduction to embedded passives : Need for embedded passives; Design Library; Embedded resistor processes – Embedded capacitors : Processes for embedding capacitors; Case study examples; Summary of materials in packaging
Conclusion and Summary – Exclusive chapter wise summary
This Course is provided by IISc Bangalore as part of NPTEL online courses.
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