An Introduction to Electronics System Packaging

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Contents:
Overview of electronic systems packaging : Introduction and Objectives of the course – Definition of a system and history of semiconductors – Products and levels of packaging – Packaging aspects of handheld products; Case studies in applications – Case Study (continued); Definition of PWB, summary and Questions for review

Semiconductor Packaging Overview : Basics of Semiconductor and Process flowchart; Video on “Sand-to-Silicon” – Wafer fabrication, inspection and testing – Wafer packaging; Packaging evolution; Chip connection choices – Wire bonding, TAB and flipchip-1 – Wire bonding, TAB and flipchip-2; Tutorials

Semiconductor Packages : Why packaging? & Single chip packages or modules (SCM) – Commonly used packages and advanced packages; Materials in packages – Advances packages (continued); Thermal mismatch in packages; Current trends in packaging – Multichip modules (MCM)-types; System-in-package (SIP); Packaging roadmaps; Hybrid circuits; Quiz on packages

Electrical Design considerations in systems packaging (L. Umanand) : Electrical Issues : Resistive Parasitic,Capacitive and Inductive Parasitic,Layout guidelines and the Reflection problem,Interconnection
CAD for Printed Wiring Boards : Quick Tutorial on packages; Benefits from CAD; Introduction to DFM, DFR & DFT – Components of a CAD package and its highlights – Design Flow considerations; Beginning a circuit design with schematic work and component layout – Demo and examples of layout and routing; Technology file generation from CAD; DFM check list and design rules;Design for Reliability

Printed Wiring Board Technologies: Board-level packaging aspects : Review of CAD output files for PCB fabrication; Photo plotting and mask generation – Process flow-chart; Vias; PWB substrates – Substrates continued; Video highlights; Surface preparation – Photoresist and application methods; UV exposure and developing; Printing technologies for PWBs – PWB etching; Resist stripping; Screen-printing technology – Through-hole manufacture process steps; Panel and pattern plating methods – Video highlights on manufacturing; Solder mask for PWBs; Multilayer PWBs; Introduction to microvias – Microvia technology and Sequential build-up technology process flow for high-density interconnects – Conventional Vs HDI technologies; Flexible circuits; Tutorial session

Surface Mount Technology : SMD benefits; Design issues; Introduction to soldering – Reflow and Wave Soldering methods to attach SMDs – Solders; Wetting of solders; Flux and its properties; Defects in wave soldering – Vapour phase soldering, BGA soldering and Desoldering/Repair; SMT failures – SMT failure library and Tin Whiskers – Tin-lead and lead-free solders; Phase diagrams; Thermal profiles for reflow soldering; Lead-free alloys – Lead-free solder considerations; Green electronics; RoHS compliance and e-waste recycling issues

Thermal Design considerations in systems packaging (L. Umanand) : Thermal Design considerations in systems packaging
Embedded Passives Technology :
Introduction to embedded passives : Need for embedded passives; Design Library; Embedded resistor processes – Embedded capacitors : Processes for embedding capacitors; Case study examples; Summary of materials in packaging
Conclusion and Summary – Exclusive chapter wise summary

Course Curriculum

Introduction and Objectives of the course Details 51:43
Definition of a system and history of semiconductors Details 52:47
Products and levels of packaging Details 0:1
Packaging aspects of handheld products; Case studies in applications Details 57:3
Case Study (continued); Definition of PWB, summary and Questions for review Details 55:44
Basics of Semiconductor and Process flowchart; Video on Details 57:48
Wafer fabrication, inspection and testing Details 56:57
Wafer packaging; Packaging evolution; Chip connection choices Details 1:53
Wire bonding, TAB and flipchip-1 Details 57:11
Wire bonding, TAB and flipchip-2; Tutorials Details 1:2:45
Why packaging? & Single chip packages or modules (SCM) Details 59:36
Commonly used packages and advanced packages; Materials in packages Details
Advances packages (cont),Thermal mismatch in packages,Current trends in packaging Details 58:48
Multichip modules (MCM)-types; System-in-package (SIP); Packaging roadmaps Details 59:13
Electrical Issues — I; Resistive Parasitic Details 56:2
Electrical Issues — II; Capacitive and Inductive Parasitic Details 58:45
Electrical Issues — III; Layout guidelines and the Reflection problem Details 58:18
Electrical Issues — IV; Interconnection Details 46:35
Quick Tutorial on packages; Benefits from CAD; Introduction to DFM, DFR & DFT Details 56:55
Components of a CAD package and its highlights Details 58:53
Design Flow considerations; Beginning a circuit design with schematic work Details 57:4
Demo and examples of layout and routing; Technology file generation from CAD; Details 1:1:54
Review of CAD output files for PCB fabrication; Photo plotting and mask generation Details 55:41
Process flow-chart; Vias; PWB substrates Details 1:32
Substrates continued; Video highlights; Surface preparation Details 58:13
Photoresist and application methods,UV exposure and developing Details 1:1:24
PWB etching; Resist stripping; Screen-printing technology Details 59:25
Through-hole manufacture process steps; Panel and pattern plating methods Details 58:50
Video highlights on manufacturing; Solder mask for PWBs; Multilayer PWBs Details 59:39
Microvia technology and Sequential build-up technology process flow for high-density Details 59:33
Conventional Vs HDI technologies; Flexible circuits; Tutorial session Details 1:4:15
SMD benefits; Design issues; Introduction to soldering Details 59:11
Reflow and Wave Soldering methods to attach SMDs Details 58:33
Solders; Wetting of solders; Flux and its properties; Defects in wave soldering Details 58:52
Vapour phase soldering, BGA soldering and Desoldering/Repair; SMT failures Details 56:49
SMT failure library and Tin Whiskers Details 58:34
Tin-lead and lead-free solders,Phase diagrams,Thermal profiles for reflow soldering Details 58:42
Lead-free solder considerations,green electronics,RoHS compli & e-waste recycling iss Details 1:1:27
Thermal Design considerations in systems packaging Details 1:3:47
Introduction to embedded passives; Need for embedded passives; Design Library Details 0:59
Embedded capacitors; Processes for embedding capacitors; Case study examples Details 1:17
Chapter-wise summary Details 58:2

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