Contents:
Introduction to VLSI – Design and Technology Overview of VLSI – Yield and cost Estimation of VLSI Chips – Defects, Contamination & Clean Room Requirements – Wafer Cleaning Technology – Oxidation of Silicon – Reaction Kinetics of Oxide Growth in Silicon – Oxidation Techniques, Growth Rate & Characterization – Lithography Process – Photoresists – Optical Lithography Techniques – Exposure Tools and Optical Effects in Lithography – Advanced Lithography Techniques (X-ray,Ion-Beam,E-Beam) – Etching – Dry & Plasma Etching – Impurity Diffusion in Semiconductors

Diffusion Theory and Diffusion Systems – Impurities in Silicon and Diffusion Profile – Evaluation of Diffused Layers in Semiconductors -Ion Implantation : Range Theory and Stopping Mechanism – Ion Implantation Theory and Channeling – Ion Implant Machine – High Energy High Dose Implantation – Epitaxy Techniques and Classifications – Vapor Phase and Liquid Phase Epitaxy – VPE Growth Kinetics and MBE – Defects in Epitaxy Growth, Selective Epitaxy – Chemical Vapor Deposition (CVD): APCVD, LPCVD – CVD Techniques: PECVD, RTCVD, UHVCVD – Metal CVD and MOCVD

Materials for Contacts and Interconnects in VLSI – Metallization Techniques – I : Physical Evaporation – Metallization Techniques – II : Sputtering – Metallization Problems and Failure Mechanisms – Silicides and Copper Metallization – Isolation Technology in VLsI – Advanced Isolation Technology in VLSI – Bipolar VLSI Process Technology – MOS VLSI Process Technology – Advanced VLSI MOS/CMOS Process – CMOS/BiCMOS Process Technology – VLSI Assembly & Packaging : Chip and Wire Bonding – VLSI Packaging Technology

Other Resources

Course Curriculum

Skal 1 – Introduction to VLSI Technology Details 8:45
Skal 2 – Design and Technology Overview of VLSI – I Details 58:19
Skal 3 – Design and Technology Overview of VLSI – II Details 57:55
Skal 4 – Yield and cost Estimation of VLSI Chips Details 58:36
Skal 5 – Defects, Contamination & Clean Room Requirements Details 57:50
Skal 6 – Wafer Cleaning Technology Details 58:5
Skal 7 – Oxidation of Silicon Details 58:10
Skal 8 – Reaction Kinetics of Oxide Growth in Silicon Details 58:5
Skal 9 – Oxidation Techniques, Growth Rate & Characterization Details 58:16
Skal 10 – Lithography Process Details 58:15
Skal 11 – Photoresists Details 57:57
Skal 12 – Optical Lithography Techniques Details 59:1
Skal 13 – Exposure Tools and Optical Effects in Lithography Details 57:52
Skal 14 – Advanced Lithography Techniques (X-ray,Ion-Beam,E-Beam) Details 0:59
Skal 15 – Etching Details 0:1
Skal 17 – Dry & Plasma Etching Details 55:59
Skal 19 – Impurity Diffusion in Semiconductors Details 58:1
Skal 20 – Diffusion Theory and Diffusion Systems Details 58:15
Skal 21 – Impurities in Silicon and Diffusion Profile Details 58:5
Skal 22 – Evaluation of Diffused Layers in Semiconductors Details 58:11
Skal 23 – Ion Implantation : Range Theory and Stopping Mechanism Details 59:1
Skal 24 – Ion Implantation Theory and Channeling Details 58:2
Skal 25 – Ion Implant Machine Details 58:38
Skal 26 – High Energy High Dose Implantation Details 58:38
Skal 27 – Epitaxy Techniques and Classifications Details 59:11
Skal 28 – Vapor Phase and Liquid Phase Epitaxy Details 58:23
Skal 29 – VPE Growth Kinetics and MBE Details 0:59
Skal 30 – Defects in Epitaxy Growth, Selective Epitaxy Details 58:11
Skal 31 – Chemical Vapor Deposition (CVD): APCVD, LPCVD Details 58:9
Skal 32 – CVD Techniques: PECVD, RTCVD, UHVCVD Details 57:55
Skal 33 – Metal CVD and MOCVD Details 58:10
Skal 34 – Materials for Contacts and Interconnects in VLSI Details 59:10
Skal 35 – Metallization Techniques – I : Physical Evaporation Details 57:17
Skal 36 – Metallization Techniques – II : Sputtering Details 55:52
Skal 37 – Metallization Problems and Failure Mechanisms Details 58:11
Skal 38 – Silicides and Copper Metallization Details 57:54
Skal 39 – Isolation Technology in VLsI Details 57:44
Skal 40 – Advanced Isolation Technology in VLSI Details 57:49
Skal 41 – Bipolar VLSI Process Technology Details 1:1
Skal 43 – MOS VLSI Process Technology Details 0:58
Skal 44 – Advanced VLSI MOS or CMOS Process Details 58:4
Skal 45 – CMOS or BiCMOS Process Technology Details 58:1
Skal 46 – VLSI Assembly & Packaging : Chip and Wire Bonding Details 58:42
Skal 47 – VLSI Packaging Technology Details 56:42

These video tutorials are delivered by IIT Kharagpur as part of NPTEL online courses program.

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